2022
LANCOOL III (2022)
برج متوسط عالي تدفق الهواء بألواح أمامية وجانبية وعلوية شبكية كاملة، بتهوية استثنائية للبناءات المتحمسة المبرّدة هوائياً وبـ AIO.
Mid Tower Case
المعايير والمكونات المتوافقة
Micro-ATX Form Factor (mATX)
Intel Corporation (standardized)
Mini-ITX Form Factor
VIA Technologies (originated)
E-ATX (Extended ATX) Form Factor
Intel Corporation (extended by motherboard vendors)
ATX Motherboard Form Factor
Intel Corporation
4-Pin PWM Fan Control
Intel Corporation (standardized)
ARGB (Addressable RGB, 5V 3-pin)
Various (ASUS AURA, MSI Mystic Light, etc.)
SFX Power Supply Form Factor
Intel Corporation
Tempered Glass Side Panel
Various Case Manufacturers
Positive Airflow / Mesh Front Panel
Thermal / Airflow Standard
PCIe Slot Cover and Drive Bay Management
Case Manufacturers
Triple-Fan GPU Cooling
GPU AIB Partners
المواصفات التقنية
| Form Factor | Mid Tower ATX |
| Supported Mobo | E-ATX, ATX, Micro-ATX, Mini-ITX |
| Max Gpu Length | 435 mm |
| Max Cpu Cooler Height | 176 mm |
| Drive Bays | 2× 3.5" HDD, 4× 2.5" SSD |
| Expansion Slots | 8 |
| Front U S B | 1× USB 3.2 Gen 2 Type-C, 2× USB 3.0 |
| Fan Support | Front: 3×140/120mm, Top: 4×120mm, Rear: 1×120mm, Bottom: 3×120mm |
| Radiator Support | Front: 420/360mm, Top: 360/480mm, Rear: 120mm |
| Dimensions | 494 × 236 × 510 mm (H×W×D) |
| Weight | 10.0 kg |
| Msrp | $149.99 |
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