AMD 3D V-Cache Technology

AMD 3D V-Cache stacks an additional 64 MB SRAM L3 cache chiplet directly on top of the CPU compute die (CCD) using TSMC's SoIC (System on Integrated Chips) through-silicon via (TSV) bonding technology. The Ryzen 7 5800X3D (96 MB L3 total) and Ryzen 7 7800X3D (96 MB L3) demonstrated that tripling available L3 cache reduces L3 cache miss rates in games by >30%, translating to 10–35% gaming performance gains. The stacked SRAM limits sustained clock speeds slightly because it blocks direct thermal contact on the top surface, capping the cooler's ability to extract heat from the hotter compute die beneath.