Liquid Metal Thermal Interface Material

Liquid metal TIM uses a gallium-indium (Galinstan-type) alloy that remains liquid at room temperature, providing 50–73 W/m·K thermal conductivity — roughly 10–20× higher than premium standard thermal paste (4–8 W/m·K). It is used to replace the factory TIM between CPU die and IHS after delidding, or applied directly between IHS and CPU cooler base for maximum performance. Several gaming laptops from manufacturers including Alienware m15/m18 R-series and ASUS ROG Zephyrus use liquid metal from the factory between the die and copper spreader. Liquid metal is incompatible with aluminium surfaces (galvanic corrosion) and requires careful handling to prevent electrical shorts.