💾 Memory Standard

💾
DDR5 SDRAM (JEDEC JESD79-5B)
JEDEC Solid State Technology Association
💾
DDR4 SDRAM (JEDEC JESD79-4C)
JEDEC Solid State Technology Association
💾
LPDDR5X (Low Power DDR5 Extreme)
JEDEC Solid State Technology Association
💾
GDDR6X Memory
Micron Technology
💾
GDDR6 Memory
Samsung / Micron / SK Hynix
💾
DDR5 SO-DIMM (Laptop Memory)
JEDEC Solid State Technology Association
💾
LPDDR4X (Low Power DDR4 Extreme)
JEDEC
💾
DDR4 SO-DIMM (Laptop Memory)
JEDEC
💾
ECC Memory (Error-Correcting Code)
JEDEC
💾
HBM3 (High Bandwidth Memory 3)
JEDEC / SK Hynix

⚡ Bus Interface Standard

⚡
PCI Express 5.0 (PCIe 5.0)
PCI Special Interest Group (PCI-SIG)
⚡
PCI Express 4.0 (PCIe 4.0)
PCI Special Interest Group (PCI-SIG)
⚡
PCI Express 3.0 (PCIe 3.0)
PCI Special Interest Group (PCI-SIG)
⚡
AMD Smart Access Memory (SAM / Resizable BAR)
AMD / PCI-SIG
⚡
Resizable BAR (Intel / NVIDIA ReBAR)
PCI-SIG

💿 Storage Form Factor

💿
M.2 2280 Form Factor
PCI Special Interest Group (PCI-SIG) / JEDEC
💿
M.2 2230 Form Factor
PCI-SIG / JEDEC
💿
2.5-inch SATA SSD Form Factor
SATA-IO

🖥️ CPU Platform

🖥️
Intel LGA1700 Socket
Intel Corporation
🖥️
Intel LGA1851 Socket
Intel Corporation
🖥️
AMD AM5 Socket (LGA1718)
Advanced Micro Devices (AMD)
🖥️
AMD AM4 Socket
Advanced Micro Devices (AMD)
🖥️
Apple Silicon M4 / M4 Pro / M4 Max
Apple Inc.
🖥️
Apple Silicon M3 / M3 Pro / M3 Max
Apple Inc.
🖥️
Intel vPro Platform
Intel Corporation
🖥️
Intel Arrow Lake Platform (LGA1851)
Intel Corporation
🖥️
AMD Zen 5 / Ryzen 9000 Platform (AM5)
Advanced Micro Devices (AMD)
🖥️
Intel Hybrid Architecture (P-core + E-core)
Intel Corporation
🖥️
AMD 3D V-Cache Technology
Advanced Micro Devices
🖥️
Intel Turbo Boost Max Technology 3.0
Intel Corporation
🖥️
AMD Precision Boost 2
Advanced Micro Devices

🔌 Power Delivery Standard

🔌
ATX 3.0 / PCIe CEM 5.0 Power Standard
Intel Corporation
🔌
ATX 3.1 Power Specification
Intel Corporation
🔌
USB Power Delivery 3.1 (140 W)
USB Implementers Forum (USB-IF)

🔌 Power Connector

🔌
12VHPWR Connector (PCIe 5.0 Power)
PCI Special Interest Group (PCI-SIG)
🔌
MagSafe 3
Apple Inc.

🔗 Connectivity Standard

🔗
USB4 Gen 3×2 (40 Gbps)
USB Implementers Forum (USB-IF)
🔗
Thunderbolt 4
Intel Corporation
🔗
Thunderbolt 5
Intel Corporation
🔗
Thunderbolt 4 (Laptop / Mobile)
Intel Corporation
🔗
2.5 Gigabit Ethernet (2.5GbE)
NBASE-T Alliance / IEEE 802.3bz
🔗
ARGB (Addressable RGB, 5V 3-pin)
Various (ASUS AURA, MSI Mystic Light, etc.)
🔗
USB 3.2 Gen 2×2 (20 Gbps)
USB Implementers Forum (USB-IF)
🔗
AV1 Hardware Encode / Decode
Alliance for Open Media (AOM)
🔗
HEVC / H.265 Hardware Decode
ITU-T / ISO
🔗
USB 3.2 Gen 1 (5 Gbps)
USB Implementers Forum
🔗
USB 3.2 Gen 2 (10 Gbps)
USB Implementers Forum

🖥️ Display Interface

🖥️
HDMI 2.1
HDMI Forum
🖥️
DisplayPort 2.1
VESA
🖥️
OLED Display Technology
Samsung Display / LG Display / BOE
🖥️
QD-OLED Panel Technology
Samsung Display Corporation
🖥️
DisplayPort Alt Mode over USB-C
VESA / USB Implementers Forum
🖥️
DisplayPort 1.4 / 1.4a
VESA
🖥️
HDMI 2.0 / 2.0b
HDMI Forum

📶 Wireless Standard

📶
Wi-Fi 7 (IEEE 802.11be)
IEEE / Wi-Fi Alliance
📶
Wi-Fi 6E (IEEE 802.11ax 6 GHz)
IEEE / Wi-Fi Alliance
📶
Bluetooth 5.3
Bluetooth Special Interest Group (Bluetooth SIG)
📶
Wi-Fi 6 (IEEE 802.11ax 2.4 / 5 GHz)
IEEE / Wi-Fi Alliance

✨ Upscaling Technology

✨
AMD FidelityFX Super Resolution (FSR)
Advanced Micro Devices (AMD)
✨
NVIDIA DLSS 3
NVIDIA Corporation
✨
Intel XeSS (Xe Super Sampling)
Intel Corporation

💡 Memory Profile Standard

💡
XMP 3.0 (Extreme Memory Profile)
Intel Corporation
💡
EXPO (Extended Profiles for Overclocking)
Advanced Micro Devices (AMD)
💡
XMP 2.0 (Extreme Memory Profile for DDR4)
Intel Corporation

⚡ PSU Efficiency Standard

⚡
80 PLUS Gold Efficiency
Ecos Consulting / 80 PLUS Program
⚡
80 PLUS Titanium Efficiency
Ecos Consulting / 80 PLUS Program
⚡
80 PLUS Platinum Efficiency
Ecos Consulting / 80 PLUS Program
⚡
80 PLUS Bronze Efficiency
Ecos Consulting
⚡
Fully Modular PSU Design
Various PSU Manufacturers

📐 Motherboard Form Factor

📐
Micro-ATX Form Factor (mATX)
Intel Corporation (standardized)
📐
Mini-ITX Form Factor
VIA Technologies (originated)
📐
E-ATX (Extended ATX) Form Factor
Intel Corporation (extended by motherboard vendors)
📐
ATX Motherboard Form Factor
Intel Corporation

🔩 Mobile Platform

🔩
Intel Core HX Mobile Platform
Intel Corporation
🔩
AMD Ryzen AI/HX Mobile Platform
Advanced Micro Devices (AMD)
🔩
Intel Evo Platform
Intel Corporation
🔩
Qualcomm Snapdragon X Elite / X Plus
Qualcomm Technologies
🔩
AMD Advantage / AMD HYPR-RX
Advanced Micro Devices
🔩
NVIDIA Max-Q Design
NVIDIA Corporation
🔩
MUX Switch (Advanced Optimus / GPU Multiplexer)
Various Laptop Manufacturers
🔩
AMD Ryzen 7000 / 8000 Mobile Platform (Phoenix / Hawk Point)
Advanced Micro Devices
🔩
Intel Meteor Lake / Core Ultra 100H Series Platform
Intel Corporation

🔩 Operating System

🔩
Windows 11
Microsoft Corporation

🔩 GPU Architecture

🔩
NVIDIA Ada Lovelace Architecture
NVIDIA Corporation
🔩
AMD RDNA 3 Architecture
Advanced Micro Devices (AMD)
🔩
Intel Arc Alchemist (A-Series)
Intel Corporation
🔩
Intel Arc Battlemage (B-Series)
Intel Corporation
🔩
AMD RDNA 2 Architecture
Advanced Micro Devices
🔩
NVIDIA Ampere Architecture
NVIDIA Corporation

💿 Storage Protocol

💿
PCIe 5.0 NVMe SSD
PCI Special Interest Group / NVM Express Inc.
💿
3D TLC NAND Flash
Samsung / SK Hynix / Micron / Kioxia
💿
3D QLC NAND Flash
Intel / Micron / Samsung / SK Hynix
💿
SLC Write Cache (Dynamic NAND Cache)
Storage Device Manufacturers

❄️ Cooling Technology

❄️
4-Pin PWM Fan Control
Intel Corporation (standardized)
❄️
M.2 NVMe Heatsink (Thermal Throttle Prevention)
Motherboard Manufacturers
❄️
Vapor Chamber Cooling
Various Cooler Manufacturers
❄️
Direct Touch Heat Pipe (HDT)
Various Cooler Manufacturers
❄️
Triple-Fan GPU Cooling
GPU AIB Partners

🔩 Graphics API

🔩
DirectX 12 Ultimate
Microsoft
🔩
Vulkan 1.3
Khronos Group
🔩
Hardware Ray Tracing (DXR / Vulkan RT)
Microsoft / Khronos Group

🔩 Compute API

🔩
CUDA 12
NVIDIA Corporation
🔩
OpenCL 3.0
Khronos Group

🔩 Network Standard

🔩
10 Gigabit Ethernet (10GbE)
IEEE (802.3ae)
🔩
Intel I226-V 2.5GbE NIC
Intel Corporation

🔌 Storage Interface

🔌
SD Card UHS-II / UHS-I
SD Association

🔩 Display Technology

🔩
AMD FreeSync Premium / Premium Pro
Advanced Micro Devices
🔩
NVIDIA G-Sync Compatible
NVIDIA Corporation
🔩
VESA DisplayHDR 1000
VESA
🔩
Mini-LED Backlight
Various Panel Manufacturers
🔩
IPS Display Technology (In-Plane Switching)
LG Display / AU Optronics

🔩 Security Standard

🔩
TPM 2.0 (Trusted Platform Module)
Trusted Computing Group
🔩
UEFI Secure Boot
UEFI Forum
🔩
Windows Hello Biometric Authentication
Microsoft Corporation

🔩 Audio Standard

🔩
Dolby Atmos
Dolby Laboratories
🔩
DTS:X Ultra
Xperi Corporation
🔩
Realtek ALC Audio Codec
Realtek Semiconductor

🔩 Chassis Standard

🔩
SFX Power Supply Form Factor
Intel Corporation
🔩
Tempered Glass Side Panel
Various Case Manufacturers
🔩
PCIe Slot Cover and Drive Bay Management
Case Manufacturers
🔩
MIL-STD-810H Durability
US Department of Defense

🔩 Thermal Standard

🔩
Positive Airflow / Mesh Front Panel
Thermal / Airflow Standard
🔩
Liquid Metal Thermal Interface Material
Thermal Grizzly / Conductonaut