🔩 Standards & Components

Shared Standards & Components

Universal hardware standards and components that span multiple brands and platforms

💾 Memory Standard

DDR5 SDRAM (JEDEC JESD79-5B)

JEDEC Solid State Technology Association

DDR4 SDRAM (JEDEC JESD79-4C)

JEDEC Solid State Technology Association

LPDDR5X (Low Power DDR5 Extreme)

JEDEC Solid State Technology Association

Micron Technology

Samsung / Micron / SK Hynix

DDR5 SO-DIMM (Laptop Memory)

JEDEC Solid State Technology Association

LPDDR4X (Low Power DDR4 Extreme)

DDR4 SO-DIMM (Laptop Memory)

ECC Memory (Error-Correcting Code)

HBM3 (High Bandwidth Memory 3)

JEDEC / SK Hynix

⚡ Bus Interface Standard

PCI Express 5.0 (PCIe 5.0)

PCI Special Interest Group (PCI-SIG)

PCI Express 4.0 (PCIe 4.0)

PCI Special Interest Group (PCI-SIG)

PCI Express 3.0 (PCIe 3.0)

PCI Special Interest Group (PCI-SIG)

AMD Smart Access Memory (SAM / Resizable BAR)

Resizable BAR (Intel / NVIDIA ReBAR)

💿 Storage Form Factor

M.2 2280 Form Factor

PCI Special Interest Group (PCI-SIG) / JEDEC

M.2 2230 Form Factor

PCI-SIG / JEDEC

2.5-inch SATA SSD Form Factor

🖥️ CPU Platform

Intel LGA1700 Socket

Intel Corporation

Intel LGA1851 Socket

Intel Corporation

AMD AM5 Socket (LGA1718)

Advanced Micro Devices (AMD)

Advanced Micro Devices (AMD)

Apple Silicon M4 / M4 Pro / M4 Max

Apple Silicon M3 / M3 Pro / M3 Max

Intel vPro Platform

Intel Corporation

Intel Arrow Lake Platform (LGA1851)

Intel Corporation

AMD Zen 5 / Ryzen 9000 Platform (AM5)

Advanced Micro Devices (AMD)

Intel Hybrid Architecture (P-core + E-core)

Intel Corporation

AMD 3D V-Cache Technology

Advanced Micro Devices

Intel Turbo Boost Max Technology 3.0

Intel Corporation

AMD Precision Boost 2

Advanced Micro Devices

🔌 Power Delivery Standard

ATX 3.0 / PCIe CEM 5.0 Power Standard

Intel Corporation

ATX 3.1 Power Specification

Intel Corporation

USB Power Delivery 3.1 (140 W)

USB Implementers Forum (USB-IF)

🔌 Power Connector

12VHPWR Connector (PCIe 5.0 Power)

PCI Special Interest Group (PCI-SIG)

🔗 Connectivity Standard

USB4 Gen 3×2 (40 Gbps)

USB Implementers Forum (USB-IF)

Intel Corporation

Intel Corporation

Thunderbolt 4 (Laptop / Mobile)

Intel Corporation

2.5 Gigabit Ethernet (2.5GbE)

NBASE-T Alliance / IEEE 802.3bz

ARGB (Addressable RGB, 5V 3-pin)

Various (ASUS AURA, MSI Mystic Light, etc.)

USB 3.2 Gen 2×2 (20 Gbps)

USB Implementers Forum (USB-IF)

AV1 Hardware Encode / Decode

Alliance for Open Media (AOM)

HEVC / H.265 Hardware Decode

USB 3.2 Gen 1 (5 Gbps)

USB Implementers Forum

USB 3.2 Gen 2 (10 Gbps)

USB Implementers Forum

🖥️ Display Interface

DisplayPort 2.1

OLED Display Technology

Samsung Display / LG Display / BOE

QD-OLED Panel Technology

Samsung Display Corporation

DisplayPort Alt Mode over USB-C

VESA / USB Implementers Forum

DisplayPort 1.4 / 1.4a

HDMI 2.0 / 2.0b

📶 Wireless Standard

Wi-Fi 7 (IEEE 802.11be)

IEEE / Wi-Fi Alliance

Wi-Fi 6E (IEEE 802.11ax 6 GHz)

IEEE / Wi-Fi Alliance

Bluetooth Special Interest Group (Bluetooth SIG)

Wi-Fi 6 (IEEE 802.11ax 2.4 / 5 GHz)

IEEE / Wi-Fi Alliance

✨ Upscaling Technology

AMD FidelityFX Super Resolution (FSR)

Advanced Micro Devices (AMD)

NVIDIA Corporation

Intel XeSS (Xe Super Sampling)

Intel Corporation

💡 Memory Profile Standard

XMP 3.0 (Extreme Memory Profile)

Intel Corporation

EXPO (Extended Profiles for Overclocking)

Advanced Micro Devices (AMD)

XMP 2.0 (Extreme Memory Profile for DDR4)

Intel Corporation

⚡ PSU Efficiency Standard

80 PLUS Gold Efficiency

Ecos Consulting / 80 PLUS Program

80 PLUS Titanium Efficiency

Ecos Consulting / 80 PLUS Program

80 PLUS Platinum Efficiency

Ecos Consulting / 80 PLUS Program

80 PLUS Bronze Efficiency

Ecos Consulting

Fully Modular PSU Design

Various PSU Manufacturers

📐 Motherboard Form Factor

Micro-ATX Form Factor (mATX)

Intel Corporation (standardized)

Mini-ITX Form Factor

VIA Technologies (originated)

E-ATX (Extended ATX) Form Factor

Intel Corporation (extended by motherboard vendors)

ATX Motherboard Form Factor

Intel Corporation

🔩 Mobile Platform

Intel Core HX Mobile Platform

Intel Corporation

AMD Ryzen AI/HX Mobile Platform

Advanced Micro Devices (AMD)

Intel Evo Platform

Intel Corporation

Qualcomm Snapdragon X Elite / X Plus

Qualcomm Technologies

AMD Advantage / AMD HYPR-RX

Advanced Micro Devices

NVIDIA Max-Q Design

NVIDIA Corporation

MUX Switch (Advanced Optimus / GPU Multiplexer)

Various Laptop Manufacturers

AMD Ryzen 7000 / 8000 Mobile Platform (Phoenix / Hawk Point)

Advanced Micro Devices

Intel Meteor Lake / Core Ultra 100H Series Platform

Intel Corporation

🔩 Operating System

Microsoft Corporation

🔩 GPU Architecture

NVIDIA Ada Lovelace Architecture

NVIDIA Corporation

AMD RDNA 3 Architecture

Advanced Micro Devices (AMD)

Intel Arc Alchemist (A-Series)

Intel Corporation

Intel Arc Battlemage (B-Series)

Intel Corporation

AMD RDNA 2 Architecture

Advanced Micro Devices

NVIDIA Ampere Architecture

NVIDIA Corporation

💿 Storage Protocol

PCIe 5.0 NVMe SSD

PCI Special Interest Group / NVM Express Inc.

3D TLC NAND Flash

Samsung / SK Hynix / Micron / Kioxia

3D QLC NAND Flash

Intel / Micron / Samsung / SK Hynix

SLC Write Cache (Dynamic NAND Cache)

Storage Device Manufacturers

❄️ Cooling Technology

4-Pin PWM Fan Control

Intel Corporation (standardized)

M.2 NVMe Heatsink (Thermal Throttle Prevention)

Motherboard Manufacturers

Vapor Chamber Cooling

Various Cooler Manufacturers

Direct Touch Heat Pipe (HDT)

Various Cooler Manufacturers

Triple-Fan GPU Cooling

GPU AIB Partners

🔩 Graphics API

DirectX 12 Ultimate

Hardware Ray Tracing (DXR / Vulkan RT)

Microsoft / Khronos Group

🔩 Compute API

NVIDIA Corporation

🔩 Network Standard

10 Gigabit Ethernet (10GbE)

Intel I226-V 2.5GbE NIC

Intel Corporation

🔌 Storage Interface

SD Card UHS-II / UHS-I

🔩 Display Technology

AMD FreeSync Premium / Premium Pro

Advanced Micro Devices

NVIDIA G-Sync Compatible

NVIDIA Corporation

VESA DisplayHDR 1000

Mini-LED Backlight

Various Panel Manufacturers

IPS Display Technology (In-Plane Switching)

LG Display / AU Optronics

🔩 Security Standard

TPM 2.0 (Trusted Platform Module)

Trusted Computing Group

UEFI Secure Boot

Windows Hello Biometric Authentication

Microsoft Corporation

🔩 Audio Standard

Dolby Laboratories

Xperi Corporation

Realtek ALC Audio Codec

Realtek Semiconductor

🔩 Chassis Standard

SFX Power Supply Form Factor

Intel Corporation

Tempered Glass Side Panel

Various Case Manufacturers

PCIe Slot Cover and Drive Bay Management

Case Manufacturers

MIL-STD-810H Durability

US Department of Defense

🔩 Thermal Standard

Positive Airflow / Mesh Front Panel

Thermal / Airflow Standard

Liquid Metal Thermal Interface Material

Thermal Grizzly / Conductonaut